Potassium fluoride,anhydrous
           Potassium fluoride,extra pure
           Potassium fluoride,Granular
           Silicon Dioxide
           Hydrofluoric acid
           Synthetic Cryolite
           Potassium Fluoaluminate
           Ammonium bifluoride
           Potassium Bifluoride
           Aluminium fluoride
           Sodium fluoride
           Potassium Fluorosilicate
           Fluorosilicic Acid
           Sodium silicofluoride
           Potassium Hydroxide Flakes
           Magnesium Fluoride
           Magnesium fluorosilicate
           Barium Fluoride
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Hydrofluoric acid is one of the strongest inorganic acids and is used extensively in industry and research. It differs from other acids in that the fluoride ion readily penetrates the skin, causing destruction of deep tissue layers and even bone. Authors have previously described numerous topical treatments. This report describes one method of treatment emphasizing immediate skin cleansing and the application of calcium gluconate gel, which is followed by calcium gluconate subcutaneous injections when necessary. An accurate occupational history and physical examination are important aspects of patient assessment. Prompt treatment resulted in relief of pain and a satisfactory clinical result in all cases. A significant delay in treatment was responsible for permanent impairment in 2 of 14 patients.

An etching mechanism for thin silicon dioxide films in hydrofluoric acid solutions has been deduced from experimental results and a review of literature sources. The etching reaction consists of two elementary chemical reactions at the surface of the silicon dioxide thin film. First, acidic components from the etchant break up the siloxane bonds at the SiO2 surface leaving silanol species. This process creates more space at the SiO2 surface for the fluorinated species to react with the silicon nucleophilically. Experiments at low hydrofluoric acid(HF) concentrations (below 4 M HF) show that the etching reaction is nearly first order. Over a wider range of HF concentration, however, the reaction order approaches 2. Moreover, the addition of strong acids to  hydrofluoric acid(HF) solutions enhances the etching reaction by increasing the rate of the “surface opening” reaction. Literature data support this view of SiO2 etching. Application of these ideas will enhance etching for large area surface micromachining.

Nano-treated with hydrofluoric acid of TiO2 photocatalyst to COD removal evaluation index photocatalytic oxidation test oil sewage, analyzes the reasons impact of hydrofluoric acid photocatalytic properties of Nano TiO2. This article discusses the corrosion properties of silica in buffered hydrofluoric acid(BHF) etching solution, studied silica etching solution etching rate, surface roughness and corrosion depth ratio as NH4F, HF ratio and temperature variation of the etching solution.